DRC错误标记由带有两个字母的“领结”符号组成。字母代码指示违反了哪种约束类型。

Net-to-Net Spacing DRC错误标记代码为大写;相反,Same Net Spacing代码是小写的。

DRC错误标记代码定义

下表列出了每种DRC错误标记代码组合及其关联的约束违例。该列表根据DRC错误标记中的字母按字母顺序排列。

CodeConstraint Violation
A – AAcute angle to cavity edge
B – BBond Pad to Bond Pad
B – LBond Pad to Line
B – SBond Pad to Shape
C – CComponent to cavity edge
Package to package
Soldermask to soldermask
D – CDFA Package to package
D – DMechanical Drill Hole to Mechanical Drill Hole
Mechanical Drill Hole to Drill Hole
Drill Hole to Drill Hole
D – INegative plane islands
D – LMechanical Drill Hole to Cline
Drill Hole to Cline
D – PPhase Tolerance – Tolerance
Mechanical Drill Hole to Pin
Drill Hole to Pin
D – SMechanical Drill Hole to Shape
Drill Hole to Shape
D – VMechanical Drill Hole to Via
Drill Hole to Via
E – DMax Final Settle Max
Min First Switch Min
Noise Margin Min
Overshoot Max
Propagation Delay Max
Propagation Delay Min
Propagation Delay Path Type
Relative Propagation Delay Delta
Relative Propagation Delay Path Type
Relative Propagation Delay Scope
E – LLayer Sets
Max Exposed Length
Total Etch Length Max
Total Etch Length Min
E – PParallelism
E – SMax Stub Length
E – TVerify Schedule
E – VMax Via Count
E – XActive Window
Max Xtalk
Max Peak Xtalk
Sensitive Window
Maximum Inter Crosstalk
Maximum Intra Crosstalk
F – CBond finger to component
Bond Pad to Component Edge
Bond Finger to cavity edge
F – FBond Pad to Bond Pad (same net)
Bond Pad to Bond Pad (different net)
I – MSingle-line Impedance Target and Tolerance
J – NAllow – Ts
K – BBond Pad to Route Keepin
Bond Pad to Route Keepout
Bond Pad to Via Keepout
K – CPackage to place keepin
Package to place keepout
K – LLine to Route Keepin
Line to Route Keepout
K – PThru Pin to Route Keepin
Thru Pin to Route Keepout
SMD to Route Keepin
SMD to Route Keepout
Test Pin to Route Keepin
Test Pin to Route Keepout
Test Pin to No Probe
K – SShape to Route Keepin
Shape to Route Keepout
K – VVia to Route Keepin
Via to Route Keepout
Via to Via Keepout
BB Via to Route Keepin
BB Via to Route Keepout
BB Via to Via Keepout
Test Via to Route Keepin
Test Via to Route Keepout
Test Via to Via Keepout
Test Via to No Probe
L – LLine to Line
L – SShape to Line
L – WLine Width – Max
Line Width – Min
Neck – Max Length
Neck – Min Width
M – ASoldermask alignment
Pad Soldermask Alignment
Symbol Soldermask Alignment
M – CSymbol Soldermask to Pad Soldermask
Minimum Cavity Size
M – LSoldermask to pad and cline
M – MPad Soldermask to Pad Soldermask
Any Metal to Any Metal Spacing
M – PSoldermask to Pin
M – SSoldermask to shape
M – VSoldermask to Via
Matched Via count violation
N – SNegative Plane to Sliver
O – CObject exposure to cavity
P – BBond Pad to SMD Pin
Bond Pad to Test Pin
Bond Pad to Thru Pin
P – DMechanical Pin Antipad to Drill Hole
P – LLine to SMD Pin
Line to Test Pin
Line to Thru Pin
Mechanical Pin Antipad to Cline
P – MPastemask pad to pastemask pad
Pastemask to package pastemask
P – PSMD Pin to SMD Pin
SMD Pin to Test Pin
Test Pin to Test Pin
Thru Pin to SMD Pin
Thru Pin to Test Pin
Thru Pin to Thru Pin
Mechanical Pin Antipad to Pin
P – SShape to SMD Pin
Shape to Test Pin
Shape to Thru Pin
Mechanical Pin Antipad to Shape
P – VSMD Pin to BB Via
SMD Pin to Test Via
SMD Pin to Thru Via
Test Pin to BB Via
Test Pin to Test Via
Test Pin to Thru Via
Thru Pin to BB Via
Thru Pin to Test Via
Thru Pin to Thru Via
Mechanical Pin Antipad to Via
R – CPackage to room
S – NAllow – Etch
S – SShape to Shape
T – CTestpoint loc. to component
Testpoint pad to component
Testpoint under component
V – BBond Pad to BB Via
Bond Pad to Test Via
Bond Pad to Thru Via
V – GAllow – Pad-Pad Connect
BB Via Stagger – Max
BB Via Stagger – Min
Min BB Via Gap
V – LLine to BB Via
Line to Test Via
Line to Thru Via
V – NVias
Vialist constraint violation
V – SShape to BB Via
Shape to Test Via
Shape to Thru Via
V – VBB Via to BB Via
BB Via to Test Via
Test Via to Test Via
Thru Via to BB Via
Thru Via to Test Via
Thru Via to Thru Via
W – AMin. bonding wire length
Wire to die edge angle
W – DBonding wire diameter
W – CWire to Cavity Edge Spacing
Wire End to Cavity Edge Spacing
W – EWire end to wire end
W – FWire to bond finger
W – IMax. bonding wire length
W – PWire to pin
W – WWire to wire (same profile)
W – XWire to wire (different profile)
X – DExternally Determined Violation
最后修改日期:2020-08-28

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